Electronic Design and Solution Fair 2003
Special Package booth for exhibiters of DAC and DATE, company's affiliated with EDAC
Guide to Exhibition Regulations


Participating in the EDSFair was an ideal environment because we were able to meet with the most advanced design industries in Japan in one convenient location. The EDSFair was the perfect opportunity to demonstrate our new hardware-assisted simulators to our customers residing in Japan while gaining valuable feedback on how to better our presence in the Japanese marketplace. Japan's importance in the EDA community cannot be overlooked and the EDSFair provides an ideal forum for new technology and designs.
David Rinehart,
Director of Marketing, Aldec, Inc.

Japan is a very important market place for us and the EDA community as a whole.
The EDSFair was an excellent opportunity to demonstrate RUBICAD's stat-of-the-art IC layout correction technology to Japan's leading edge semiconductor companies and intensify our contacts to highly qualified decision makers.
Michael Reinhardt,
President and Founder of RUBICAD Corp.
*Period: Thursday, January 30 - Friday, January 31, 2003 2 days
*Place: Pacifico Yokohama, Yokohama-shi, Kanagawa-ken, Japan
*Sponsored by: Japan Electronics and Information Technology Industries Association (JEITA)
*Managed by: Japan Electronics Show Association (JESA)
*Contact information: Yoshinaga, Japan Electronics Show Association / edsfair@jesa.or.jp

* Exhibition Categories and Scope of Exhibits
* Eligible Exhibitors
* Booth Specifications
* Participation Fees
* Additional Costs
* Application and Payment
* Determination of Booth Location
* Cancellation and Reduction of Booth Spaces
* Cancellation Owing to Calamity
* Prohibitions and Restrictions
* Responsibility for Exhibits
* Suites
* Seminars by Exhibitors
* Guideline for Advertising Placement
cube Information and Application for Exhibition / Access and Hotels
Flow Chart
After Application
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Nov. 1 Deadline: Web Banner Advertisements /Submitting Materials (Optional)
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Nov. 9Deadline: Draft Paper for Guidebook Article
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Nov. 22Deadline: Customized Message Mail-Out Service (Mailing List) / Submitting Message (Optional)
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Nov. 29Deadline: Advertisement in Guidebook / Submission of Computer Data (Optional)
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Dec. 6 Distribute PR Magazines and Envelopes (Japanese)
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Dec. 6Deadline: Advertisement in Guidebook / Black-and-White Camera-Ready Copy (Optional)
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Dec. 13Deadline: Advertisement in Guidebook / 2-Color and 4-Color Camera-Ready Copy (Color Separation Film) (Optional)
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Jan. 10Deadline: Block Advertisements on Fair Venue Map / Submitting Materials (Optional)
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Jan. 28-29
9:00 a.m.
Set-Up
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Jan. 30 - 31 10:00 a.m.-18:00 p.m.Exhibition
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Jan. 31 18:00 p.m.Take-Down

Application Form for Special Package Booth

Japan Electronics Show Association
Telephone : +81-3-5402-7601 Facsimile : +81-3-5402-7605 
E-mail : edsfair@jesa.or.jp http://www.jesa.or.jp
ALL Rights Reserved by Japan Electronics Show Association.