
Japan Electronics and Information Technology Industries Association
Chairman
Hajime Sasaki
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Broadband communications are propelling
our society toward an age in which anyone anywhere will be able to
easily relay and receive information of all kinds. In the home, electronic
equipment will be linked together into far-reaching digital networks.
Semiconductors are at the heart of this "digital revolution."
Semiconductors must rapidly improve in performance and energy efficiency,
breaking through the boundaries of what is possible today to reach
new heights. Japan's Semiconductor MIRAI Project-a national R&D project
for next-generation technologies-and a variety of other research and
development efforts are being promoted to establish process and design
technologies for SoC (Systems-on-Chip). In line with these efforts,
needs are growing for higher-level electronic circuit design technologies,
and solutions technologies such as software.
In its 4th year, Electronic Design and Solution Fair 2004 (EDSFair2004)
is Asia's Leading Exhibition of Essential Design Solution for SoC
Technologies. Here, you will find new design and solutions technologies
combining cutting-edge electronic design automation (EDA), device
and IP (intellectual property) design service technologies.
Since 2001, when a cooperative partnership was launched with the Electronic
Design Automation Consortium (EDAC) of the United States, EDSFair
has risen to prominence as an international convention on a par with
the Design Automation
Conference (DAC) in America and Design,
Automation and Test in Europe (DATE). EDSFair has also won strong
global acclaim as the largest exhibition of its kind in Asia.
EDSFair2004 will be held on January 29 and 30, 2004, in Pacifico Yokohama.
Simultaneous events, such as the FPGA/PLD Design Conference, University
Plaza and ASP-DAC
(Asia and South Pacific Design Automation Conference), will enrich
and enhance the EDSFair's effectiveness as a place for technological
interchange between industry, academia and government organizations.
I am confident that this event will provide exhibitors and visitors
alike with unique opportunities for information exchange and new business
development. All of us involved with the Fair look forward to your
active participation.
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