Electronic Design and Solution Fair 2009
 
SPATIAL CORP 807
 
 
Location Pier City Shibaura Bldg 10F, 3-18-1 Kaigan, Minato-ku, Tokyo, Japan
108-0022
Contact info c/o Dassault Systems K. K.
TEL:03-5442-4526
FAX:03-5442-4040
E-mail:koji.takaba@3ds.com
URL:http://www.spatial.jp
Exhibit introduction The EDA 3D Analysis Suite enables rapid development of 3D analysis and visualization
features within current EDA physical design flows. The software component suite provides unique productivity and time-to-market (TTM) advances to tool developers, including 3D model creation from industry standard design data, interrogation, meshing, and visualization that brings significant advantages to all aspects of
electronic design—on-chip, packaging, and PCB. This extensible 3D technology is readily integrated into applications via a set of robust APIs to enhance 3D functionality of existing EDA tools to form the basis of entirely new applications that serve emerging markets.
Integrating with your application the EDA 3D Analysis Suite provides all the preprocessing
and visualization necessary to link your 2D application to your 2.5D and/or 3D proprietary solver capability.
   
   



 




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