Exhibitor Detail : Gem Design Technologies, Inc.
The newest version of SiP feasibility study tool "GemPackage" is presented. GemPackage is a light weight yet powerful package level physical planning tool. It enables substrate routability analysis, net optimization, 3D-design, all under the chip-package-board global view. The wide variety of the package structures are supported from traditional wire-bonding packages to TSV based 3D-ICs. Link to SI/PI/Thermal analysis tools is well supported. Good as a communication gear for chip/package/board designers.
1-8 Hibikino, Wakamatsu, Kitakhushu, Fukuoka