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 Exhibitor Detail : Gem Design Technologies, Inc.
315 

Gem Design Technologies, Inc.
World First

Exhibit introduction

The newest version of SiP feasibility study tool "GemPackage" is presented. GemPackage is a light weight yet powerful package level physical planning tool. It enables substrate routability analysis, net optimization, 3D-design, all under the chip-package-board global view. The wide variety of the package structures are supported from traditional wire-bonding packages to TSV based 3D-ICs. Link to SI/PI/Thermal analysis tools is well supported. Good as a communication gear for chip/package/board designers.


Contact info

President
TEL:093-691-0030
FAX:093-691-0036
E-mail:murata@gemdt.com
URL:http://www.gemdt.com/

Address

1-8 Hibikino, Wakamatsu, Kitakhushu, Fukuoka
808-0135

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