Exhibitor Detail : Gem Design Technologies, Inc.
408 

Gem Design Technologies, Inc.
World First

Exhibit introduction

GemPackage -- Chip/Package/Board Co-Design Tool

The latest version of the IC package FS tool "GemPackage" is presented. It also suits well to chip/package/board co-design purposes, by its unique "super-hierarchical" design capability. The recent improvements include: (1) 3D-IC enhancements related to TSV and embedded substrate. (2) WLCSP and RDL design related enhancements, and (3) Improvements for large designs, such as grouping balls for multi-channel high-speed interfaces, managing net name differences in chip/package/board design hierarchies, uncrossing the global routing paths, etc.


GemPDA -- Photo Diode Array Feasibility Study Tool (New)

A new automated tool is presented for designing photo diode arrays in photo couplers and photo sensors.


Contact info

Gem Design Technologies, Inc.
Hiroshi Murata
TEL:093-691-0030
FAX:093-691-0036
E-mail:murata@gemdt.com
URL:http://www.gemdt.com/

Address

1-8 Hibikino, Wakamatsu,
Kitakyushu, Fukuoka, 808-0135 Japan
808-0135

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