GemPackage -- Chip/Package/Board Co-Design Tool
The latest version of the IC package FS tool "GemPackage" is presented. It also suits well to chip/package/board co-design purposes, by its unique "super-hierarchical" design capability. The recent improvements include: (1) 3D-IC enhancements related to TSV and embedded substrate. (2) WLCSP and RDL design related enhancements, and (3) Improvements for large designs, such as grouping balls for multi-channel high-speed interfaces, managing net name differences in chip/package/board design hierarchies, uncrossing the global routing paths, etc.
GemPDA -- Photo Diode Array Feasibility Study Tool (New)
A new automated tool is presented for designing photo diode arrays in photo couplers and photo sensors.
1-8 Hibikino, Wakamatsu,
Kitakyushu, Fukuoka, 808-0135 Japan