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Leti and Docea Joint Expertise on 3D Integration, Thermal and Low-Power Design.

Leti and Docea Power announced that they will combine their expertise in 3D silicon integration and thermal and low-power design. Under the terms of the common laboratory agreement, Leti will use EDA tools provided by Docea Power to build 3D IC designs and methodologies for consumer and wireless applications. Leti is the leading global research center committed to creating and commercializing innovation in micro- and nanotechnologies. Docea Power, the design-for-low-power company, delivers software for power and thermal analysis at the architectural level.
The collaboration aims at improving design quality and validating a new generation of high level design tools, like Docea’s Aceplorer, for 3D-IC wireless and consumer applications.



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メディアパートナー

Tech-On

EDN Japan

半導体産業新聞

EE Times Japan

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